EIA JESD22-A101-B-1997 Steady-State Temperature Humidity Bias Life Test.pdf

上传人:kailiqingxi 文档编号:63410432 上传时间:2018-12-25 格式:PDF 页数:6 大小:44KB
返回 下载 相关 举报
EIA JESD22-A101-B-1997 Steady-State Temperature Humidity Bias Life Test.pdf_第1页
第1页 / 共6页
EIA JESD22-A101-B-1997 Steady-State Temperature Humidity Bias Life Test.pdf_第2页
第2页 / 共6页
EIA JESD22-A101-B-1997 Steady-State Temperature Humidity Bias Life Test.pdf_第3页
第3页 / 共6页
EIA JESD22-A101-B-1997 Steady-State Temperature Humidity Bias Life Test.pdf_第4页
第4页 / 共6页
EIA JESD22-A101-B-1997 Steady-State Temperature Humidity Bias Life Test.pdf_第5页
第5页 / 共6页
亲,该文档总共6页,到这儿已超出免费预览范围,如果喜欢就下载吧!
资源描述
EIAJEDEC
STTANDARD
mossoom
l'est Miethod AL0I-B
Steady State Temperature Humidity
Bias Life Ttest
EIAJJESD22-A101-B
(Revision OFJESD22-A101-A)
APRIL 1997
ELECTRONIC INDUSTRIES ASSOCIATION
ENGINEERING DEPARTMENT
JEDEC Standard No. 22-A101-B
Page 1
Test Method A101-B Steady State Temperature Humidity Bias Life Test
From JEDEC Council Ballot JCB-96-64, formulated under the cognizance of JC-14
Committee on Reliability Test Methods for Packaged Devices.
I Purpose
The Steady-state Temperature Humidity Bias Life Test is peformed for the purpose of
evaluating the reliability of non-hermetic packaged solid-state devices in humid environments. It
employs conditions of temperature, humidity, and bias which accelerate the penetration of
moisture through the external protective material (encapsulant or seal)or along the inteface
between the external protective material and the metallic conductors which pass through it
2 Apparatus
The test requires a temperature-humidity test chamber capable of maintaining a specified
temperature and relative humidity continuously, while providing electrical connections to the
devices under test in a specified biasing configuration
2.1 Temperature and relative humidity
The chamber must be capable of providing controlled conditions of temperature and relative
humidity during ramp-up to, and ramp-down from the specified test conditions
2.2 Devices under stress
Devices under stress must be physically located to minimize temperature gradients
2.3 Minimize release of contamination
Care must be exercised in the choice of board and socket materials. to minimize release of
contamination, and to minimize degradation due to corrosion and other mechanisms
2.4 onic contamination
Tonic contamination of the test apparatus(card cage, test boards, sockets, wiring, storage
containers, etc. ) shall be controlled to avoid test artifacts
2.5 Deionized water
Deionized water with a minimum resistivity of 1 megohm-cm at room temperature shall be used
展开阅读全文
相关资源
猜你喜欢
相关搜索

当前位置:首页 > 国外标准 > 美国电子工业协会EIA


版权所有:www.WDFXW.net 

鲁ICP备14035066号-3