MIL-PRF-19500.406G-2006.pdf

MIL-PRF-19500/406G 23 June 2006 SUPERSEDING MIL-PRF-19500/406F 24 November 2004 PERFORMANCE SPECIFICATION SHEET SEMICONDUCTOR DEVICES, DIODE, SILICON, VOLTAGE REGULATOR, TYPES 1N4460, 1N4460C, 1N4460D THROUGH 1N4496, 1N4496C, 1N4496D, AND 1N6485, 1N6485C, 1N6485D THROUGH 1N6491, 1N6491C, 1N6491D, 1N4460US, 1N4460CUS, 1N4460DUS THROUGH 1N4496US, 1N4496CUS, 1N4496DUS, AND 1N6485US, 1N6485CUS, 1N6485DUS THROUGH 1N6491US, 1N6491CUS, 1N6491DUS, PLUS C AND D TOLERANCE SUFFIX; JAN, JANTX, JANTXV, AND JANS This specification is approved for use by all Departments and Agencies of the Department of Defense. The requirements for acquiring the product described herein shall consist of this specification sheet and MIL-PRF-19500. 1. SCOPE 1.1 Scope. This specification covers the performance requirements for microminiature 1.5 watt silicon, low leakage, voltage regulator diodes with tolerances of 5 percent, 2 percent, and 1 percent. Four levels of product assurance are provided for each encapsulated device type as specified in MIL-PRF-19500. 1.2 Physical dimensions. See figure 1 (similar to DO-41), and figure 2 (surface mount). * 1.3 Maximum ratings. TSTG = TJ(MAX) = -65C to +175C. Maximum ratings are as shown in maximum and primary test ratings (see 3.11) herein and as follows: PT at TL = +112C L = .375 inch (9.53 mm) PT at TEC = +145C PT(PCB1) TA =+55C PT(PCB2) TA =+55C RJL at L = 0.375 inch (9.52 mm) RJEC RJA(PCB1) RJA(PCB2) Barometric pressure reduced (high altitude operation) 1.5 W (1) 1.5 W (2) 0.6 W (3) 1.5 W (4) 42C/W 20C/W 200C/W 80C/W 8 mm Hg (1) Derate: See figure 3 herein. (2) Derate: See figure 4 herein. (3) Derate: See figure 5 herein. For PCB ratings on all surface mount (US) devices, the pads = .067 inch (1.70 mm) x .105 inch (2.67 mm); For the axial-leaded devices, the pads (axial) = .092 inch (2.34 mm) diameter, strip = .030 inch (7.62 mm) x 1 inch (25.4 mm) long, axial lead length L .187 inch ( 4.76 mm). (4) Derate: See figure 6 herein. For PCB ratings on all surface mount (US) devices, the pads = .500 inch (12.70 mm) x .500 inch (12.7 mm) or the equivalent of .250 square inches in area each. For the axial-leaded devices, the pads (axial) = .092 inch (2.34 mm) diameter, strip = .030 inch (7.62 mm) x 1 inch (25.4 mm) long, axial lead length L .187 inch ( 4.76 mm). For the axial-leaded devices, the pads are also of the same equivalent area as described for the surface mount US devices. AMSC N/A FSC 5961 The documentation and process conversion measures necessary to comply with this revision shall be completed by 23 September 2006. INCH-POUND Comments, suggestions, or questions on this document should be addressed to Defense Supply Center, Columbus, ATTN: DSCC-VAC, P.O. Box 3990, Columbus, OH 43218-3990, or emailed to Semiconductordscc.dla.mil. Since contact information can change, you may want to verify the currency of this address information using the ASSIST Online database at http:/assist.daps.dla.mil. Source: http:/ - Downloaded: 2008-05-06T01:34Z Check the source to verify that this is the current version before use. MIL-PRF-19500/406G 2 1.4 Primary electrical characteristics. Primary electrical characteristics are as shown in maximum and primary test ratings (see 3.11) and as follows: 3.3 V dc VZ 200 V dc (nominal). a. 1N4460D through 1N4496D and 1N6485D through 1N6491D are 1 percent voltage tolerance. b. 1N4460C through 1N4496C and 1N6485C through 1N6491C are 2 percent voltage tolerance. c. 1N4460 through 1N4496 and 1N6485 through 1N6491 are 5 percent voltage tolerance. RJL = 42C/W (max) at L = .375 inch (9.52 mm) (nonsurface mount). RJEC = 20C/W (max) (surface mount). 2. APPLICABLE DOCUMENTS 2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this specification, whether or not they are listed. 2.2 Government documents. 2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-PRF-19500 - Semiconductor Devices, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-750 - Test Methods for Semiconductor Devices. * (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil. or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.3 Order of precedence. In the event of a conflict between the text of this document and the references cite